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We’re excited to be at ISTFA 2025, where Tescan is showcasing our advanced failure analysis workflows that empower engineers and scientists to:
TESCAN is proud to join the 32nd International Symposium on the Physical Failure Analysis of Integrated Circuits (IPFA 2025) as a Gold Sponsor.
In his interview with DIGITIMES Asia, our APAC Managing Director shares how we’re scaling AI-driven failure analysis – and why Taiwan and Singapore is next.
BRNO - TESCAN GROUP, a global leader in electron microscopy and scientific instrumentation, is proud to announce the establishment of its newest subsidiaries, TESCAN Taiwan and TESCAN Singapore, as part of its strategic expansion in the Asia-Pacific...
With the semiconductor industry poised for explosive growth, TESCAN is stepping up its game in electron microscopy through the launch of its innovative systems: Solaris 2, Solaris X 2. In an exclusive interview, Hervé Mace, new Global Director of...
New systems enhance semiconductor research with automated TEM lamella preparation, advanced failure analysis, and precision delayering with in-situ electrical analysis.
Join us for an upcoming webinar that promises to bring new insights to semiconductor device analysis. Organized jointly by TESCAN Group and Imina Technologies, this session will delve into innovative methods for automated large-area Plasma FIB delayering...
“Pairing Laser Ablation and Xe Plasma FIB-SEM: An Approach for Precise End-Pointing in Large-Scale Physical Failure Analysis in the Semiconductor Industry,”
