TESCAN SOLARIS 2

Solution for high quality automated
TEM lamella preparation

Advanced TEM Lamella Preparation for Modern Semiconductor Laboratories

TESCAN SOLARIS 2 is a fully automated Ga FIB-SEM designed for high-precision TEM lamella preparation, equipped with AI-driven TEM AutoTEM Pro™ software. Engineered for applications in Failure Analysis, R&D, and Quality Control, SOLARIS 2 seamlessly integrates advanced SEM and FIB alignments, ensuring consistent system readiness and reducing time to data.

It excels in handling a wide range of electronic devices, including the latest in logic, memory, power, and display technologies, providing reliable performance for your most demanding sample preparation needs.

Precision Without Compromise

SOLARIS 2 delivers exceptional FIB resolution with minimal beam damage and milling artifacts. It’s not just for standard (top-down) lamella - you’ll also master inverted, planar, and double-cross lamella with our optimized single-step in-situ lift-out geometries, ensuring your samples are ready with precision and efficiency.

Ga FIB Meets UHR-SEM Immersion Optics

Experience the powerful combination of Ga-focused ion beam and ultra-high-resolution SEM immersion optics. This integration ensures top-tier performance in ion beam milling and SEM end-pointing, offering unmatched surface sensitivity and contrast, even with the most complex semiconductor samples.

USING AUTOMATION TO INCREASE THROUGHPUT AND ENSURE REPRODUCIBLE QUALITY FOR TEM  SAMPLE PREPARATION
TESCAN TEM AUTOPREP PRO - ROBUST AND RELIABLE AUTOMATED TEM SAMPLE PREPARATION

Maximize Your TEM Sample Preparation with SOLARIS 2

Automated
Brilliance

Automated Brilliance

Automatically craft high-quality TEM samples with minimal damage, hands-free.

Advanced
Flexibility

Advanced Flexibility

Adapt to any lamella geometry with exceptional quality and reduced amorphization.

Precision
Targeting 

Precision Targeting

Achieve unparalleled surface sensitivity and material contrast across diverse electronic devices and structures.

Consistent
Readiness 

Consistent Readiness

Get repeatable, high-quality results without lengthy alignments or setups.

Customizable Workflows 

Customizable Workflows

Seamlessly switch between semi-automated and fully automated sample prep tailored to your specific needs.

Intuitive
Operation

Intuitive Operation

Obtain superior data quality with ease, regardless of your FIB-SEM expertise.

High-resolution 3D reconstruction of 3D NAND memory using TESCAN SOLARIS

Discover how to prepare TEM samples

from logic, memory, and 3D NAND.

Main Benefits of TESCAN SOLARIS 2

Fast, Precise TEM Samples

Produce ultra-thin TEM samples from sub-10 nm nodes in under an hour with TESCAN TEM AutoPrep™ Pro. Fully automated from lift-out to final FIB polishing, it delivers consistently superior results every time.

Fast, Precise TEM Samples

Pinpoint Accuracy for Advanced Devices

Target single transistor lines in GAA or FinFET devices with pinpoint accuracy using AI-driven fiducial mark recognition and high-resolution imaging from the Triglav™ SEM column, featuring advanced SE and BSE detectors for enhanced contrast at the beam coincident point.

Pinpoint Accuracy for Advanced Devices

Adaptable Lamella Prep with OptiLift™

Prepare top-down, planar, and inverted lamella effortlessly with the OptiLift™ nanomanipulator, strategically placed “below FIB.” This innovative design eliminates the need for extra flipping devices, simplifying your workflow.

Adaptable Lamella Prep with OptiLift TM

Always Ready, Always Aligned

Keep your system ready with automated electron and ion column alignments that run overnight, ensuring minimal setup and maximum uptime.

Always Ready, Always Aligned

High-Resolution Imaging Excellence

The Triglav™ SEM column, designed for ultra-high-resolution imaging, delivers outstanding surface sensitivity and contrast, making it ideal for beam-sensitive materials.

High-Resolution Imaging Excellence

Streamlined Productivity

The redesigned TESCAN TEM AutoPrep™ Pro offers intuitive navigation between processes and extensive customization for any TEM lamella workflow, boosting productivity for every user.

Streamlined Productivity

Questions?
Want a virtual demo?

Our global team is ready to answer questions about TESCAN FIB-SEMs and our solutions for Semiconductors and IC Packaging Failure Analysis.