TESCAN at SEMICON Korea 2024 (TIMA)

Advancing Semiconductor Technology

TESCAN Group is a regular participant at SEMICON Korea, and 2024 will be no exception. From January 31 to February 2, our team will be at booth C262, ready to demonstrate our advancements in deep sectioning and large-volume workflow techniques for IC Packaging Failure Analysis.

Since its inception in 1987 with a modest 189 booths, SEMICON Korea has evolved to become an essential event representing the current state of the semiconductor community. This year, the event scales new heights with over 500 exhibitors and 2100 booths, showcasing the latest in semiconductor technology and equipment.

Experience the present and future of the global semiconductor industry – more info here: https://expo.semi.org/korea2024 

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Experience the present and future of the global semiconductor industry – more info here: https://expo.semi.org/korea2024 

 

Experience the Semiconductor Solutions of Tomorrow 

 

We invite industry leaders, researchers, and scholars to explore the next wave of semiconductor technology with us. Our team is eager to engage with you, understand your specific needs, and discuss how TESCAN Group’s solutions can elevate your research and development efforts. 

 

We look forward to meeting you at booth C262 at SEMICON Korea 2024! 

 

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Experience the Semiconductor Solutions of Tomorrow

We invite industry leaders, researchers, and scholars to explore the next wave of semiconductor technology with us. Our team is eager to engage with you, understand your specific needs, and discuss how TESCAN Group’s solutions can elevate your research and development efforts.

We look forward to meeting you at booth C262 at SEMICON Korea 2024!

 

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January 31 – February 2, 2024
COEX, Seoul, Korea