TESCAN GROUP Expands Presence in Asia with New Subsidiaries in Taiwan and Singapore

BRNO - TESCAN GROUP, a global leader in electron microscopy and scientific instrumentation, is proud to announce the establishment of its newest subsidiaries, TESCAN Taiwan and TESCAN Singapore, as part of its strategic expansion in the Asia-Pacific (APAC) region.

 

Building on the momentum from its recent acquisition in South Korea, these new subsidiaries will enable TESCAN to better serve its customers in Taiwan, Southeast Asia, and beyond, particularly in the rapidly evolving semiconductor and materials science sectors.

 

“We are delighted to see TESCAN’s growth in the APAC region accelerate in 2024,” said Jean-Charles Chen, CEO of TESCAN GROUP. “With the addition of our Taiwan and Singapore subsidiaries, we are further strengthening our ability to deliver innovative and reliable solutions to our customers, while addressing the unique demands of the rapidly growing APAC region.”

 

Both subsidiaries are set to be fully operational by January 1, 2025, providing comprehensive support for customers across Taiwan, IndoChina, ANZ, Southeast Asia, and India.

 

TESCAN’s enhanced presence will ensure greater proximity to its key customers and partners while positioning the company to capitalize on the strong growth opportunities in Asia and continue delivering the highest levels of innovation and customer support.

 

  

About TESCAN GROUP   

   

TESCAN was established in 1991 and has grown from a 4-5 engineer start-up initially, to a company with more than 700 employees working from more than 10 facilities in 8 countries. We are a leading player in charged-particle optical instrumentation, including Scanning and Scanning Transmission Electron Microscopy (SEM & STEM), Focused Ion Beam (FIB) and X-ray Computed Tomography (micro-CT), with more than 4000 instruments sold and operational in more than 80 countries.   

   

In 2013, it expanded by merging with ORSAY PHYSICS, a French global leader in customized focused ion and electron beam technologies, and in 2018 by acquiring XRE, a Belgian innovator in the field of Dynamic and micro-CT technologies. A further, more recent milestone was the acquisition in 2023 of TESCAN ORSAY HOLDING and all its subsidiaries by CARLYLE, a US private equity company. TESCAN GROUP is headquartered in Brno, Czech Republic, where most of our instruments are expertly assembled, tested, and shipped to customers across the globe.  

 

About EXpressLO LLC: 

 

EXpressLO LLC, founded by Dr. Lucille A. Giannuzzi, specializes in FIB specimen preparation with expertise in lift-out methods for STEM and other applications. Dr. Giannuzzi is a recognized leader in the field, with over 150 publications, multiple patents, and Fellowships in AVS, MSA, and MAS. 

           

Press Contact       

For further information, interview requests, or media inquiries, please contact:       

Linda Bilal, Senior Global Marketing Manager      

     

Marketing Department       

TESCAN GROUP, a.s.; Libušina tř. 21; 623 00 Brno – Kohoutovice; Czech Republic       

Phone: +420 530 353 478, Email: linda.bilal@tescan.com 

Something Powerful

Tell The Reader More

The headline and subheader tells us what you're offering, and the form header closes the deal. Over here you can explain why your offer is so great it's worth filling out a form for.

Remember:

  • Bullets are great
  • For spelling out benefits and
  • Turning visitors into leads.

AI/ML-Enhanced Techniques: Improving Efficiency and Accuracy in Failure Analysis

FA 4.0 aims to transform the failure analysis field by developing advanced equipment and methods, utilizing the capabilities of artificial intelligence, machine learning, and automation. The project's main innovations include:

  • § Advanced devices and equipment for failure analysis
  • § Incorporation of AI/ML-driven algorithms for image and signal analysis to improve tool performance
  • § Simplifying complex workflows by interconnecting devices with novel hardware interfaces
  • § Centralizing diagnostic data collection and correlation for efficiency
  • § Detailed defect mode detection and cataloging, incorporating metrology and electrical test data

An international consortium from Germany, France, and the Czech Republic, including industry leaders such as Infineon, STMicroelectronics, and BOSCH, have collaborated with SMEs, medium-sized companies, and renowned research institutes to realize this project.

Enhancing Failure Analysis with AI/ML-Driven Solutions

FA 4.0 is focused on maximizing the potential of AI/ML solutions to transform failure analysis. By using standardized hardware and software, the project aims to integrate tools and FA databases, enabling streamlined workflows. This approach facilitates the development of advanced AI/ML solutions, improving FA quality and productivity, and enabling failure analysis engineers to work more efficiently.

FA 4.0 is expanding current FA capabilities for measurement evaluation with signal and image-based AI/ML methodologies. These advanced techniques include AI/ML-driven evaluations of raw signals from detectors in SEMs and FIBs, as well as acoustic echoes in Scanning Acoustic Microscopes and X-Ray signals in micro CT. This enables the development of next-generation FA tools, promoting AI/ML-based, integrated workflows that enhance productivity and quality in the future of failure analysis.

Looking Towards the Future of Failure Analysis

By September 2023, TESCAN and project partners aim to implement a fully functional workflow comprising:

  • § Package defect localization/identification in PVA TEPLA's Scanning Acoustic Microscope
  • § Large volume material removal on the shared FA 4.0 stage using 3D-Micromac's laser micromachining tool,with data transfer via image header
  • § Fine sample preparation and defect analysis with SOLARIS X.

In conclusion, TESCAN and its FA 4.0 partners aim to pioneer a new phase of failure analysis, where AI/ML-driven solutions and automation enhance efficiency, accuracy, and reliability. We strive to shape the future of electronic systems and improve Europe's standing in the field of smart mobility and industrial production.

Join us as we continue this significant endeavor to redefine failure analysis!

fa-4-01-1

Discover the latest in Semiconductor Technology

Join industry professionals, researchers, and academics in exploring the future of semiconductors. Our team of experts is looking forward to engaging with industry professionals, researchers, and academics, learning about your requirements, and discussing how TESCAN's solutions can support your research and development initiatives.

Don't forget to set a reminder for this insightful journey into the future of semiconductor technology - we're eager to connect with you at SEMICON China 2023!