What to Anticipate:
- Navigating the Miniaturization Maze: Discover how advancements in miniaturization, component integration, and optimization are transforming the performance and power consumption of electronic devices, including displays and batteries.
- The Imperative of Rapid Failure Analysis: Learn about the escalating challenges in detecting defects beneath complex surfaces and the critical role of swift and accurate failure analysis in accelerating market readiness and ensuring device dependability.
- Innovations in Workflow Integration: Explore the dynamic integration of plasma FIB technology with high-speed laser ablation techniques (3D-Micromac microPREP™ PRO), enhancing the speed and precision of semiconductor failure analysis.
- Introducing TESCAN’s Large Volume Workflow Update: Delve into the latest enhancements, developed in collaboration with the European FA4.0 project, including a versatile shared sample holder and the pioneering Essence AutoSection™ software for automated alignment and ROI identification.
What You Will Gain
Participants will be treated to practical demonstrations on a variety of challenging samples, showcasing the workflow’s adaptability in handling complex devices and non-conductive materials.
Together, we will learn how these state-of-the-art techniques enable rapid, artifact-free sample preparation, essential for ultra-high-resolution SEM imaging and comprehensive failure root-cause analysis.
