Driving Breakthroughs in Semiconductor Manufacturing and Analysis
Step into the future of semiconductor innovation with TESCAN’s advanced FIB-SEM, STEM, and micro-CT tools. Our cutting-edge solutions support research, defect analysis, and process optimization.
Whether you’re advancing DRAM memory technologies, 3D NAND, or logic devices, TESCAN delivers precision and efficiency across the entire semiconductor manufacturing process, including power semiconductor devices.
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TESCAN Solutions for Semiconductor Analysis
TESCAN SOLARIS 2
TESCAN SOLARIS 2 provides AI-driven fiducial mark recognition for ultra-thin TEM samples at sub-10 nm nodes.
- Automated TEM sample preparation for logic devices.
- AI-driven precision for GAA transistors and FinFET devices.
- Lamella preparation with OptiLift™.
TESCAN SOLARIS X 2
Perform failure analysis on complex IC packaging
using Xe Plasma FIB and gallium-free TEM lamella preparation.
- Analyze 2.5D and 3D IC packages, delaminations, and voids.
- Use cross-sectioning for precise defect targeting.
TESCAN AMBER X 2
Achieve artifact-free delayering at sub-10 nm nodes with low kV Plasma FIB milling.
- Preserve device functionality with layer removal.
- Simplify defect isolation using automated end-point determination.