Master IC Packaging
Failure Analysis
with TESCAN Solutions

Experience the Power of Plasma FIB-SEM
and the Innovative TESCAN Large Volume Workflow

Explore TESCAN FIB-SEM
Dive into Large Volume Workflow

New Paper

Optimizing Semiconductor Failure Analysis: The Power of Combining Laser Ablation and Xe Plasma FIB-SEM

Unlocking the full potential of stand-alone ps-laser ablation combined with Plasma FIB-SEM makes fast and accurate failure analysis in microelectronic devices easier than ever before. Learn how to maximize productivity with simultaneous, continuous system operation in our latest paper!

Download now and transform your approach to semiconductor industry challenges
First page of a scientific paper about optimizing Semiconductor Failure Analysis.

As semiconductors advance, IC Packaging Failure Analysis labs face unparalleled challenges. Addressing complex Semiconductor Failure Analysis demands, evolving package architectures, shrinking features, and the emergence of exotic and sensitive materials is a formidable task. Meanwhile, global semiconductor companies race to develop state-of-the-art chips, packages, and chiplets for sophisticated communication devices and versatile consumer electronics.

Chip Tescan Packaging

Common IC Design and IC Packaging Fabrication Issues:

Microcracks visible at interface of solder bump, under bump metallurgy, and polyimide.
Microcracks at solder bump and under bump metallurgy interface, artefacts removed by TESCAN Rocking stage.
Visible microcracks at FIB-polished interface between solder bump and IMC layer.
Microcracks at FIB-polished interface between solder bump and under bump metallurgy layer.
Cross section of multiple dies in advanced package, prepared by laser ablation and Plasma FIB.
Delamination at C4 bump and under bump metallurgy interface.
  • Loose conductive particles
  • Plating problems
  • Wire and ribbon bond failures
  • Moisture related failures
  • Package (encapsulant) failures
  • Intermetallic formation
  • EOS / ESD related
  • Fatigue cracks
  • Micro-bump voids
  • Trace breaks and electromigration
  • Warpage of TSV chips

Transforming Sustainable IC Packaging Failure Analysis with Cutting-Edge TESCAN Solutions

Sustainable IC Packaging Failure Analysis hinges on diverse expertise and an extensive range of non-destructive and destructive procedures provided by FA tools. TESCAN supports its customers with innovative solutions, including non-destructive micro-CT failure analysis applications, Plasma FIB-SEM SOLARIS X, and the Large Volume Workflow, which combines Laser Ablation and Plasma FIB-SEM technology seamlessly. 

Furthermore, TESCAN works together with European partners as part of FA4.0, a project seeking to establish a more fluent failure analysis workflows among numerous failure analysis instruments, and data management for the digitalization of failure analysis laboratories in microelectronics. Find out more about FA4.0 in our Insights Section!

See for yourself how these solutions empower IC Packaging Failure Analysis at a new level.

Download our Infographic in High-Resolution
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Discover our cutting-edge solutions

Explore TESCAN FIB-SEM

EXPLORE TESCAN FIB-SEM

Experience the ultimate Plasma FIB-SEM platform for deep sectioning and high-resolution end-pointing in IC Packaging Failure Analysis.

Dive into Large Volume Workflow

DIVE INTO LARGE VOLUME WORKFLOW

Use the synergy of Plasma FIB-SEM, a stand-alone laser, and other FA tools for millimeter-scale sample preparation and analysis.

Questions?
Interested in a virtual demo?

Our global team is ready to answer questions about TESCAN FIB-SEMs and our solutions for Semiconductors and IC Packaging Failure Analysis.