TESCAN Launches SOLARIS 2, SOLARIS X 2, and AMBER X 2 for Semiconductor Analysis

To provide further insights into these new systems, TESCAN will be hosting a webinar on (DATE). From October 28 to November 1, TESCAN experts will also be available at ISTFA 2024 in San Diego, California, to discuss these innovations and their applications in semiconductor analysis. 

TESCAN SOLARIS 2: AI-Driven TEM Lamella Preparation 

The TESCAN SOLARIS 2 is designed for fully automated TEM lamella preparation using the AI-powered TESCAN TEM AutoPrep™ Pro software. This system produces high-quality, ultra-thin samples for sub-10 nm technology nodes, such as advanced logic and memory devices. 

Key features include: 

• Fully Automated TEM Lamella Preparation: AI-driven precision delivers high-quality samples with minimal damage, supporting various geometries such as top-down, planar, and inverted lamellae. 
   

• Flexible Sample Handling: Achieve high-resolution end-pointing for advanced devices like GAA and FinFET transistors with the Triglav™ SEM column. 
   

• User-Friendly Operation: Automated workflows reduce setup time and optimize system readiness, ensuring productivity for users at all experience levels. 

TESCAN SOLARIS X 2: Ga-Free TEM Preparation and Advanced Failure Analysis 

The TESCAN SOLARIS X 2 extends the capabilities of physical failure analysis with its Mistral™ Xe Plasma FIB column, providing large-area cross-sectioning and gallium-free TEM lamella preparation for complex semiconductor packages, including 2.5D, 3D IC, and MEMS devices. 

Key features include: 

• Large-Scale Failure Analysis: Perform deep cross-sectioning, reaching buried structures up to 1 mm in depth, using the Mistral™ Xe Plasma FIB. 
   

• Ga-Free TEM Lamella Preparation: Produce high-quality, gallium-free lamellae, preserving sample integrity for advanced packaging applications. 
   

• Precise Defect Targeting: The Triglav™ SEM column enables nanometer-level accuracy for defect isolation in advanced semiconductor packaging. 

TESCAN AMBER X 2: Precision Delayering with In-Situ Electrical Analysis 

The TESCAN AMBER X 2 provides precision delayering with uniform, artifact-free results, supporting sub-10 nm technology nodes. This system is built for electrical failure analysis, allowing in-situ verification through SEM-based nanoprobing and efficient defect isolation. 

Key features include: 

• Uniform, Artifact-Free Delayering: Achieve consistent results with tailored gas chemistries like Nanoflat Chase and C-maze, optimized for NMOS and PMOS transistors. 
   

• In-Situ Electrical Analysis: SEM-based nanoprobing allows real-time characterization of electrical failures during the delayering process. 
   

• Automated Delayering: TESCAN Delayering™ Software automates end-point determination, targeting specific layers for detailed failure analysis. 

These systems are built to address the growing complexities of modern semiconductor technologies, improving the efficiency and accuracy of failure analysis for researchers and engineers. 

Join Our Webinar 

TESCAN is hosting an exclusive webinar, “Introduction to TESCAN’s FIB-SEM Solutions for Semiconductor Failure Analysis and R&D Laboratories,” which will offer an in-depth look into the capabilities of our platforms, including cross-sectioning, TEM preparation, and delayering. 

• Date & Time: Mon, Oct 21, 2024 5:00 PM - 6:00 PM CEST 

• Registration Link 

Meet Us at ISTFA 2024 

TESCAN will also be present at ISTFA 2024 from October 28 to November 1, 2024, where our solutions can be experienced firsthand. Our experts will be available at booth #NUMBER to answer questions and provide insights into how our systems can enhance semiconductor failure analysis.

For more details, visit us at ISTFA or learn more on our website.