FA 4.0: Developing Advanced Failure Analysis Equipment and Methods

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Pairing Laser Ablation and Xe Plasma FIB-SEM: An approach for precise end-pointing in large-scale Physical Failure Analysis in the Semiconductor Industry

Do you want to reduce the time and cost of sample preparation for failure analysis?

“Pairing Laser Ablation and Xe Plasma FIB-SEM: An Approach for Precise End-Pointing in Large-Scale Physical Failure Analysis in the Semiconductor Industry,”

FA 4.0: Developing Advanced Failure Analysis Equipment and Methods

Incorporating Artificial Intelligence/Machine Learning (AI/ML) and Automation for Improved Defect Recognition and Efficiency

TESCAN is part of an ongoing project, set to conclude in September 2023, called Failure Analysis (FA) 4.0. This project is...