FA 4.0: Developing Advanced Failure Analysis Equipment and Methods

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INVITATION

TESCAN at SEMICON Korea 2024

Showcasing the Future of Semiconductors

TESCAN is thrilled to be part of SEMICON Korea 2024, from January 31 to February 2. Visit us at booth A854 as we unveil our latest advancements in semiconductor research and FIB-SEM solutions for semiconductor...

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BLOGPOST

FA 4.0: Developing Advanced Failure Analysis Equipment and Methods

Incorporating Artificial Intelligence/Machine Learning (AI/ML) and Automation for Improved Defect Recognition and Efficiency

TESCAN is part of an ongoing project, set to conclude in September 2023, called Failure Analysis (FA) 4.0. This project is...

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