AI/ML-Enhanced Techniques: Improving Efficiency and Accuracy in Failure Analysis
FA 4.0 aims to transform the failure analysis field by developing advanced equipment and methods, utilizing the capabilities of artificial intelligence, machine learning, and automation. The project's main innovations include:
- § Advanced devices and equipment for failure analysis
- § Incorporation of AI/ML-driven algorithms for image and signal analysis to improve tool performance
- § Simplifying complex workflows by interconnecting devices with novel hardware interfaces
- § Centralizing diagnostic data collection and correlation for efficiency
- § Detailed defect mode detection and cataloging, incorporating metrology and electrical test data
An international consortium from Germany, France, and the Czech Republic, including industry leaders such as Infineon, STMicroelectronics, and BOSCH, have collaborated with SMEs, medium-sized companies, and renowned research institutes to realize this project.
Enhancing Failure Analysis with AI/ML-Driven Solutions
FA 4.0 is focused on maximizing the potential of AI/ML solutions to transform failure analysis. By using standardized hardware and software, the project aims to integrate tools and FA databases, enabling streamlined workflows. This approach facilitates the development of advanced AI/ML solutions, improving FA quality and productivity, and enabling failure analysis engineers to work more efficiently.
FA 4.0 is expanding current FA capabilities for measurement evaluation with signal and image-based AI/ML methodologies. These advanced techniques include AI/ML-driven evaluations of raw signals from detectors in SEMs and FIBs, as well as acoustic echoes in Scanning Acoustic Microscopes and X-Ray signals in micro CT. This enables the development of next-generation FA tools, promoting AI/ML-based, integrated workflows that enhance productivity and quality in the future of failure analysis.
Looking Towards the Future of Failure Analysis
By September 2023, TESCAN and project partners aim to implement a fully functional workflow comprising:
- § Package defect localization/identification in PVA TEPLA's Scanning Acoustic Microscope
- § Large volume material removal on the shared FA 4.0 stage using 3D-Micromac's laser micromachining tool,with data transfer via image header
- § Fine sample preparation and defect analysis with SOLARIS X.
In conclusion, TESCAN and its FA 4.0 partners aim to pioneer a new phase of failure analysis, where AI/ML-driven solutions and automation enhance efficiency, accuracy, and reliability. We strive to shape the future of electronic systems and improve Europe's standing in the field of smart mobility and industrial production.
Join us as we continue this significant endeavor to redefine failure analysis!
