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TESCAN Discover How Rocking Stage Delivers High-Quality Polishing of Cross-Section Surfaces!
Structures such as displays, TSVs, MEMS, BGAs, flip-chips, or heterogeneous packages may require extra-large cross sections for failure analysis. Plasma FIB is the preferred solution for such milling, and TESCAN SOLARIS X speeds material removal for large cross sections with FIB+™ Xe plasma FIB column.
![TESCAN-SOLARIS-X-Rocking-stage-for-high-quality-polishing-of-cross-section-surfaces_App-note_Page_1](https://info.tescan.com/hs-fs/hubfs/TESCAN-SOLARIS-X-Rocking-stage-for-high-quality-polishing-of-cross-section-surfaces_App-note_Page_1.jpg?width=1241&height=1754&name=TESCAN-SOLARIS-X-Rocking-stage-for-high-quality-polishing-of-cross-section-surfaces_App-note_Page_1.jpg)