FIB Cross-Sectioning with
TESCAN Rocking Stage
Achieve Artifact-Free FIB Cross-Sectioning and Precise SEM End-Pointing for Challenging Samples
Key Benefits of TESCAN Rocking Stage
![](https://info.tescan.com/hubfs/photo-compare-v01-RS-1.jpg)
![](https://info.tescan.com/hubfs/photo-compare-v01-RS2.jpg)
Fixed angle polishing vs rocking polishing. Rocking polishing delivers effective removal of curtaining artefacts.
Curtaining Artifacts Being Gone
Eliminate FIB-induced curtaining artifacts caused by preferential milling rates, surface topography, or internal sample geometry for improved imaging results.
Precision at Your Fingertips
Achieve accurate end-pointing at your region of interest with SEM live monitoring throughout the milling and tilting process.
Boost Your Sample Preparation Efficiency
Maximize throughput with the TESCAN Rocking Stage set-up wizard, automating rocking procedures and positions.
Adapt to Complex Samples
![16](https://info.tescan.com/hubfs/16.png)
Enhance final sample quality for failure analysis of semiconductor devices or advanced materials with artifact-free FIB cross-sectioning and cross-section polishing.
Versatility Meets Compatibility
![13](https://info.tescan.com/hubfs/13.png)
Benefit from the new design featuring full compatibility with load locks, Beam Deceleration Mode (BDM), and the RSTEM detector, without sacrificing system versatility.
Advanced Applications for TESCAN Rocking Stage
![Surface quality before and after using TESCAN Rocking stage. Final result shows no obscuring artefacts.](https://info.tescan.com/hs-fs/hubfs/Packaging-L3-rocling-stage-img-700x700px-scalebar-logo3.png?width=476&height=476&name=Packaging-L3-rocling-stage-img-700x700px-scalebar-logo3.png)
Master the Art of Failure
Analysis
Improve the final sample quality in failure analysis of semiconductor devices or advanced materials by leveraging the TESCAN Rocking Stage's artifact-free FIB cross-sectioning capabilities.
![3D volume reconstruction of 3D EBSD analysis of solder ball done with TESCAN SOLARIS X.](https://info.tescan.com/hs-fs/hubfs/solder-ball-tomography-v01-15-400x400px.gif?width=480&height=480&name=solder-ball-tomography-v01-15-400x400px.gif)
Perfect Your
Tomography
Enhance FIB-SEM tomography acquisition by minimizing curtaining artifacts and achieving pristine imaging results with the TESCAN Rocking Stage.
![400 µm wide Plasma FIB cross section through passivation and polyimide layers to examine RDL layers.](https://info.tescan.com/hs-fs/hubfs/Packaging-L3-rocling-stage-img-700x700px-scalebar-logo4.png?width=476&height=476&name=Packaging-L3-rocling-stage-img-700x700px-scalebar-logo4.png)
Handle Large and Flat Samples with Ease
Manage an extensive array of samples and facilitates your study of a diverse sample range with the versatile design of TESCAN Rocking Stage.
Questions?
Interested in a virtual demo?
Our global team is ready to answer questions about TESCAN FIB-SEMs and our solutions for Semiconductors and IC Packaging Failure Analysis.