Automated Large-Area Plasma FIB Delayering & In-Situ Nanoprobing of Advanced Semiconductor Devices
Unlock the potential of semiconductor device analysis with our latest webinar. Learn about innovative methods for automated large-area Plasma FIB delayering and in-situ nanoprobing, presented by TESCAN Group and Imina Technologies.
This session covers the challenges of semiconductor scaling to sub-14 nm technology nodes and its impact on failure analysis and quality control. It highlights TESCAN’s advancements in Low Angle Polishing and “drilled nozzle” technologies for uniform metal layer removal and large delayered areas up to 300x300 µm². Gain insights into delayering processes for 7 nm and 5 nm devices, automated end-point detection, and the integration of Imina Technologies’ nanoprobing platform with TESCAN’s CLARA instrument for enhanced electrical analysis.
Meet the Hosts
Lukas Hladik from TESCAN, a renowned expert in FIB-SEM technologies, and Guillaume Boetsch, co-founder of Imina Technologies, both bring years of expertise in precision robotics for microscopy to this comprehensive session.
Watch the recording to gain valuable insights into advanced semiconductor device analysis and improve your technical knowledge with our integrated solutions.