micro-CT Team
Micro-CT stands out as a versatile and powerful imaging technique that provides critical insights into the intricate 3D microarchitecture of electronic components. This application note explores the essential role micro-CT plays in both failure analysis and R&D by offering high-throughput and multi-scale information.
TESCAN’s micro-CT systems offer a non-destructive, multi-scale characterization tool that is the first step in identifying faults without compromising the integrity of the sample.
Key points covered in this application note:
- Failure Analysis and R&D: Micro-CT detects tiny defects and examines devices under various conditions, providing crucial high-resolution images.
- Versatile Systems for Multi-Scale Analysis: TESCAN’s micro-CT systems handle a wide range of sample sizes. The Volume of Interest Scanning (VOIs) workflow allows high-resolution scanning of selected areas without extra sample manipulation.
- Real-Time 4D Imaging: Micro-CT enables real-time imaging of fast processes with temporal resolutions in under 5 seconds. Our dynamic CT, with Acquila™ and Panthera™ software, offers advanced 4D reconstruction and visualization.
- Battery Quality Assessment: TESCAN’s VOIs workflow quickly localizes batteries and identifies structural defects for detailed analysis, ensuring a reliable power supply in electronic devices.
- Rapid Quality Control: Our systems provide high-quality scans in minutes, with optimized scans taking less than an hour, ensuring efficient quality assurance.
- Failure Analysis in Larger Components: Micro-CT offers a non-invasive method to inspect HDD components, crucial for identifying and addressing failures like ‘head crashes’ in hard disk drives.
- TESCAN spectral CT: Enables non-destructive analysis, element identification, and chemical composition determination with high-resolution imaging, making it versatile for quality control and failure analysis in microelectronics.
Stay informed, stay ahead. Download our technical note today and embrace transformation in consumer electronics QA/QC.
.jpg)
.jpg?width=1500&height=843&name=L1%20UniTOM%20HR%20(4).jpg)
TESCAN’s Unitom HR and Unitom XL stand out with their multi-scale and dynamic capabilities.
These versatile systems offer:
- Higher throughput: Inspect more devices faster.
- Dynamic Testing: In-situ evaluation of microelectronic components, including at elevated temperatures.
- Spectral Analysis: Identifying materials with varying compositions.
- Features: All of the above features are available with micron resolution (UniTOM XL) or even sub-micron resolution (UniTOM HR), except for Spectral Analysis, which is available only on the UniTOM XL.
Our systems deliver superior image quality with excellent contrast between phases, even in the most complex samples.
Experience the Difference!
Thank you for your interest in our research and innovations.
Read more