Explore TESCAN Innovation 

Microscopy & Microanalysis (M&M) 2025 

Booth 1324

 

Book Your Live Microscopy Demo

Limited slots available during Microscopy & Microanalysis
in Salt Lake City.

 

 

 

 

 

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Connect with us at booth 1324 in Salt Lake City — where big ideas meet tiny details.

  

At TESCAN, our focus has shifted. From tools to outcomes, from specs to workflows, and features to the way discovery actually happens. 

  

This isn’t just a new generation of technology. It’s a new way of thinking, building, and solving problems. Following the rhythm of science, and together with researchers like you. 

 

TESCAN is proud to participate in Microscopy & Microanalysis 2025 (M&M 2025), the leading conference for materials science and microscopy professionals. 

 

Sign up for live demos, poster sessions, tutorials, and real conversations. All designed to sharpen your skills, challenge your workflows, and connect you with the people behind the tech. 

Discover What’s Possible...Let Us Show You!

TESCAN AMBER X 2

Powered by MISTRAL™, designed for clean, fast, precise prep 

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TESCAN AMBER X 2

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TESCAN MIRA XR

High-resolution SEM-EDS for materials science that demands both speed and clarity.

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TESCAN MIRA XR

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TESCAN TENSOR

TESCAN TENSOR

STEM Done Right

Designed to make advanced techniques feel accessible, not experimental. 

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TESCAN TENSOR

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TESCAN UniTOM XL

TESCAN UniTOM

Discovery by the Second

Structural clarity, sample integrity, and workflows that keep pace.

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TESCAN UniTOM XL

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NANOSPACE by Orsay Physics

NanoSpace is the first UHV designed FIB-SEM instrument, fully bakeable to reach ultimate vacuum level.

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NANOSPACE by Orsay Physics

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Explore Advanced SEM & FIB-SEM Tutorials at M&M 2025

Monday July 28
17:45 - 18:45
MIRA XR – Analytical UHR-SEM

From Routine to Remarkable: MIRA XR – Analytical UHR-SEM Built for Throughput at Any Scale

Introducing MIRA XR – the analytical SEM reimagined for speed, usability, and ultra-high-resolution imaging. Perfect for analytical workflows across materials science disciplines. Designed to deliver high throughput without compromising on resolution or automation. A productivity platform for every user, from QA labs to advanced research teams.

Petr Klímek photo
by Petr Klimek, PhD
Located at TESCAN's Booth 1324
Monday, July 28, 2025 | 5:45 - 6:45 PM
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Tuesday July 29
17:45 - 18:45
AMBER X 2 for Automated Sample

Plasma FIB-SEM Redefined: AMBER X 2 for Automated Sample Prep and 3D Characterization with Mistral FIB

 

Experience the power of Mistral plasma FIB in AMBER X 2 – enabling fast, precise, large-area milling. Automate TEM sample prep and 3D microanalysis with unmatched throughput and precision. Ideal for labs needing versatility, sample preparation, and analytical repeatability across complex samples.
Martin Slama photo
by Martin Slama
Located at TESCAN's Booth 1324
Tuesday, July 29, 2025 | 5:45 - 6:45 PM
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Wednesday July 30
17:45 - 18:45
AMBER 2 with Gentle Ion Beam

Dependable Way to the Thinnest Specimens: AMBER 2 with Gentle Ion Beam for High-Precision TEM Workflows

 

Discover how AMBER 2 delivers damage-free lamella prep using AURA™ Gentle Ion Beam technology. Fully integrated Ar milling ensures high-quality final thinning for demanding STEM/TEM applications. Automation ensures consistency and ease of use in multi-user environments. Optimized for labs where throughput, precision, and repeatability in sample preparation are critical.
Lucille Giannuzzi
by Lucille Giannuzzi, PhD
Located at TESCAN's Booth 1324
Wednesday, July 30, 2025 | 5:45 - 6:45 PM
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Expert Insights That Expand Your Scientific Edge

Monday July 28
13:30 - 15:00
Effect of ion energy on (S)TEM sample damage

The effect of ion energy application on damage induced in (S)TEM samples and the area of their creation, respectively to the sample surface using different ion species and techniques

 

The research was conducted to map and understand the TEM sample artifact creation during the final low-keV polishing step. The FIB-SEM with a Ga+ Liquid Metal Ion source and an Xe+ plasma FIB-SEM, as well as a dedicated low-keV broad ion beam, were used at different settings.  

 

This research investigates how various factors, such as ion species, accelerating voltages, beam profiles, and process conditions, influence the optimization of methodologies for preparing Transmission Electron Microscopy (TEM) samples with minimal damage. We evaluate key damage mechanisms and provide a detailed comparison of various preparation techniques.  

Lucille Giannuzzi
by Lucille Giannuzzi, Ph.D.
A01.1 – Advances in Focused Ion Beam Instrumentation, Applications, and Techniques for Materials and Life Sciences
Monday, July 28, 2025 | 1:30 - 3:00 PM
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Micro CT

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Tuesday July 29
15:00 - 17:00
Time-Resolved Spectral Micro-CT

Time-Resolved Spectral Micro-CT for Investigating dynamic processes in pore structures

 

Conventional micro-CT excels at visualizing rock structures but falls short in identifying chemical changes during reactive fluid flow. This study integrates spectral micro-CT with time-resolved imaging to overcome that gap. By capturing how different materials absorb X-rays across energy levels, spectral CT reveals compositional shifts in both fluids and minerals over time. Applied to leaching processes, this technique enables precise tracking of mineral transformations and fluid evolution within porous networks. The result is a powerful, non-destructive method for studying dynamic geochemical interactions at the pore scale—transforming how we investigate subsurface processes in real time.

Jan Dewanckele
by Jan Dewanckele, PhD
P10.P1 - Innovative in-situ Imaging Techniques for Material Characterization, Synthesis, and Processing
Tuesday July 29, 2025 | 3:00 - 5:00 PM
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Micro CT

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Tuesday July 29
15:00 - 17:00
Employing Xe Plasma FIB

Employing Xe Plasma FIB for Fast and Precise Sample Preparation

 

Cryo-electron tomography is becoming increasingly accessible for a wide range of samples, from single cells to complex tissues, paving the way for new discoveries in structural biology. While focused ion beam (FIB) instruments utilizing Gallium ion sources are widely employed for high-resolution and precise milling, their slower processing speed can hinder throughput in large volume applications. Modern Xe-based plasma FIB offers a fast and comparably precise alternative for the demanding workflows.

Kathrin Rudolph
by Kathrin Rudolph, PhD
B08 - Advances in cryo-EM technology
Tuesday, July 29, 2025 | 3:00 - 5:00 PM
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Micro CT

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Ready to Talk Microscopy? Let’s Schedule a Meeting.

Jason Marshall
Jason Marshall
VP of Sales, Americas
AtheyBenson
Benson Athey
Sales Manager - Midwest US
Headshot Lisa Edwards
Lisa Edwards
Sales Manager - Mid-Atlantic US
scott fuller
Scott Fuller, Ph.D.
Sales Manager - Northwest US
Jonathan Gregory
Jon Gregory
Sales Manager - South Central US
Rick Hirche
Rick Hirche
Sales Manager - Southeast
Jane Kim
Jane Kim
Sales Manager - Southwest US
Dave Zapotok
Dave Zapotok
Product Sales Manager UHV and Implantation Systems / Sales Manager - Northeast US
Lucille Giannuzzi
Lucille Giannuzzi, Ph.D.
FIB-SEM Business Development Manager
Gray-1
Michael Gray
Semiconductor Business Development Manager
Kathrin Rudolph
Kathrin Rudolph, Ph.D.
Life Science Regional Market Specialist - Europe/Americas
Dave Sampson-1
David Sampson, Ph.D.
XRM Business Development Manager
Thiago
Thiago Vilas Boas
Director of Services

Experience the Future of Microscopy at Booth 1324

M&M

 

Salt Palace Convention Center

100 S West Temple, Salt Lake City, Utah 84101
United States

TESCAN Booth 1324

Microscopy & Microanalysis (M&M) 2025 is hosted by the Microscopy Society of America and brings together global experts in electron microscopy. TESCAN is proud to contribute to this thought-leading platform.

 

FAQ

Missing M&M? Stay in touch with Us.

 

If you are unable to attend the conference, please don’t hesitate to contact us with any questions or requests — we will be happy to assist you.