Explore TESCAN Innovation
Microscopy & Microanalysis (M&M) 2025
Booth 1324
Book Your Live Microscopy Demo
Limited slots available during Microscopy & Microanalysis
in Salt Lake City.
Connect with us at booth 1324 in Salt Lake City — where big ideas meet tiny details.
At TESCAN, our focus has shifted. From tools to outcomes, from specs to workflows, and features to the way discovery actually happens.
This isn’t just a new generation of technology. It’s a new way of thinking, building, and solving problems. Following the rhythm of science, and together with researchers like you.
TESCAN is proud to participate in Microscopy & Microanalysis 2025 (M&M 2025), the leading conference for materials science and microscopy professionals.
Sign up for live demos, poster sessions, tutorials, and real conversations. All designed to sharpen your skills, challenge your workflows, and connect you with the people behind the tech.
Powered by MISTRAL™, designed for clean, fast, precise prep
TESCAN AMBER X 2
High-resolution SEM-EDS for materials science that demands both speed and clarity.
TESCAN MIRA XR
TESCAN TENSOR
STEM Done Right
Designed to make advanced techniques feel accessible, not experimental.
TESCAN TENSOR
TESCAN UniTOM
Discovery by the Second
Structural clarity, sample integrity, and workflows that keep pace.
TESCAN UniTOM XL
NanoSpace is the first UHV designed FIB-SEM instrument, fully bakeable to reach ultimate vacuum level.
NANOSPACE by Orsay Physics
From Routine to Remarkable: MIRA XR – Analytical UHR-SEM Built for Throughput at Any Scale
Introducing MIRA XR – the analytical SEM reimagined for speed, usability, and ultra-high-resolution imaging. Perfect for analytical workflows across materials science disciplines. Designed to deliver high throughput without compromising on resolution or automation. A productivity platform for every user, from QA labs to advanced research teams.
Registration Form
Plasma FIB-SEM Redefined: AMBER X 2 for Automated Sample Prep and 3D Characterization with Mistral FIB
Type text here...
Registration Form
Dependable Way to the Thinnest Specimens: AMBER 2 with Gentle Ion Beam for High-Precision TEM Workflows
Type text here...
Registration Form
The effect of ion energy application on damage induced in (S)TEM samples and the area of their creation, respectively to the sample surface using different ion species and techniques
The research was conducted to map and understand the TEM sample artifact creation during the final low-keV polishing step. The FIB-SEM with a Ga+ Liquid Metal Ion source and an Xe+ plasma FIB-SEM, as well as a dedicated low-keV broad ion beam, were used at different settings.
This research investigates how various factors, such as ion species, accelerating voltages, beam profiles, and process conditions, influence the optimization of methodologies for preparing Transmission Electron Microscopy (TEM) samples with minimal damage. We evaluate key damage mechanisms and provide a detailed comparison of various preparation techniques.
Type text here...
Micro CT
Registration form
Time-Resolved Spectral Micro-CT for Investigating dynamic processes in pore structures
Conventional micro-CT excels at visualizing rock structures but falls short in identifying chemical changes during reactive fluid flow. This study integrates spectral micro-CT with time-resolved imaging to overcome that gap. By capturing how different materials absorb X-rays across energy levels, spectral CT reveals compositional shifts in both fluids and minerals over time. Applied to leaching processes, this technique enables precise tracking of mineral transformations and fluid evolution within porous networks. The result is a powerful, non-destructive method for studying dynamic geochemical interactions at the pore scale—transforming how we investigate subsurface processes in real time.
Type text here...
Micro CT
Registration form
Employing Xe Plasma FIB for Fast and Precise Sample Preparation
Cryo-electron tomography is becoming increasingly accessible for a wide range of samples, from single cells to complex tissues, paving the way for new discoveries in structural biology. While focused ion beam (FIB) instruments utilizing Gallium ion sources are widely employed for high-resolution and precise milling, their slower processing speed can hinder throughput in large volume applications. Modern Xe-based plasma FIB offers a fast and comparably precise alternative for the demanding workflows.
Type text here...
Micro CT
Registration form
Experience the Future of Microscopy at Booth 1324

Salt Palace Convention Center
100 S West Temple, Salt Lake City, Utah 84101
United States
TESCAN Booth 1324
Microscopy & Microanalysis (M&M) 2025 is hosted by the Microscopy Society of America and brings together global experts in electron microscopy. TESCAN is proud to contribute to this thought-leading platform.
FAQ
-
What is Microscopy & Microanalysis (M&M) 2025?
Microscopy & Microanalysis 2025 (commonly known as M&M 2025) is the premier conference for materials science, microscopy, and microanalysis professionals. It will be held from July 28–31 in Salt Lake City, Utah.
-
Where can I find TESCAN at M&M 2025?
You can visit TESCAN at Booth 1324 in the Salt Palace Convention Center. Stop by for live product demos and expert-led sessions.
-
What demos will TESCAN present at M&M 2025?
TESCAN will showcase live demonstrations of our latest instruments, including the AMBER X 2 Plasma FIB-SEM, 4D-STEM, MIRA XR, and Micro-CT solutions designed for high-resolution, large-volume analysis.
-
How can I book a live demo with TESCAN?
You can book a demo directly on this page using our scheduling form. Choose a time slot that fits your M&M 2025 visit and we’ll reserve your personalized demo experience.
-
Who can attend TESCAN’s demos at M&M 2025?
TESCAN’s demos are open to all registered attendees of Microscopy & Microanalysis 2025, including researchers, microscopists, materials scientists, and industry professionals. Whether you’re a university researcher, a core facility manager, or working in applied microscopy, we welcome you to visit Booth 1324.
