Tescan at ISTFA 2025: Advancing Failure Analysis

We’re excited to be at ISTFA 2025, where Tescan is showcasing our advanced failure analysis workflows that empower engineers and scientists to:

⚡ Detect and localize defects quickly

⚡ Visualize hidden structures with 3D tomography

⚡ Gain complete insights through correlative analysis

Featured PresentationsISTFA 1

Don’t miss these Tescan contributions to the technical program:

🎤 “Leveraging Automation of TEM Sample Preparation for Increased Throughput and Reproducible Results from Advanced Multimodal STEM Analysis of 3-nm FinFET Transistors”

presented by Lukas Hladik
📅 Monday, November 17, 2025
⏰ 10:20 AM PST

🎤 “FIB and STEM Analysis of Protective Coatings”

presented by Lucille A. Giannuzzi, Ph.D.
📅 Monday, November 17, 2025
⏰ 10:40 AM PST

🎤 “Microscopy Analysis and Material Characterization - Streamlining Accurate 4D-STEM Phase-Orientation Analysis of Polymorphic Polycrystalline Thin Films in Semiconductor TEM Labs for Routine Application”

presented by Daniel Nemecek, Ph.D.
📅 Wednesday, November 19, 2025
⏰ 3:00-4:00 PM PST

📍 Meet Tescan at booth 415 and see how our integrated workflows provide deeper understanding of defects, interfaces, and device reliability.

 

 

Discover the latest in Semiconductor Technology

Join industry professionals, researchers, and academics in exploring the future of semiconductors. Our team of experts is looking forward to engaging with industry professionals, researchers, and academics, learning about your requirements, and discussing how TESCAN's solutions can support your research and development initiatives.