TESCAN at IPFA 2025 - Streamlined Failure Analysis for Advanced Packaging

Booth A20 | 5–8 August 2025 | Setia SPICE Convention Centre, Penang, Malaysia

Visit us to discover how TESCAN supports semiconductor failure analysis in advanced packaging with integrated workflows spanning non-destructive imaging, precise defect exposure, and correlated multi-modal analysis.

End-to-End Workflow for Advanced Packaging FA

TESCAN’s platform approach addresses the increasing complexity of 2.5D and 3D devices by combining speed, depth access, and correlation across all key steps:

1. Non-Destructive Failure Analysis
Micro-CT enables high-resolution 3D localization of deeply buried defects—without disturbing the sample.

2. Destructive Failure Analysis
Stand-alone laser and Plasma FIB enable accurate defect exposure.

TESCAN TENSOR supports high-throughput trenching and automated TEM lamella prep.

3. In-situ Multi-modal Observational Analysis
SE, BSE, EDS, EBSD, ToF-SIMS, and STEM provide detailed structural and elemental insights from the same region of interest.

🔗 Learn more about our packaging applications

Join Our Technical Workshop

Multi-Scale Precision: Correlative Micro-CT, Laser, and Plasma FIB for Advanced Device Integration Failure Analysis

• Date: Thursday, 7 August 2025
• Time: 16:50–17:25 | Session WS6
• Location: Breakout Room D3
• Speaker: Lukáš Hladík, Product Marketing Manager – Semiconductors

Learn how to expose and analyze buried structures in advanced devices with sub-micron precision using TESCAN’s integrated platforms.

Book a Meeting

📍 Booth A20 | 6–8 August 2025 | 8:00–17:00
Connect with our team to discuss your FA challenges and explore tailored solutions for advanced packaging.