“Plenty of room to grow.” – Sean Lee on Why TESCAN Is Doubling Down on APAC

In his interview with DIGITIMES Asia, our APAC Managing Director shares how we’re scaling AI-driven failure analysis – and why Taiwan and Singapore is next.

 

Asia-Pacific is already our biggest semiconductor market – and we’re doubling down. In his interview with DIGITIMES Asia, TESCAN’s APAC Managing Director Sean Lee outlines why we're opening new offices in Taiwan and Singapore, and how our flexible, AI-accelerated failure analysis tools are helping customers tackle complex packaging challenges with speed and precision. 

From tailored inspection workflows to faster sample prep, Lee makes it clear: we're not here to follow – we’re here to shape the future of FA. 

A big thank-you to DIGITIMES Asia for the opportunity to share our vision.
👉 Read the full interview here:   TESCAN stakes its claim in advanced packaging with AI-fueled failure analysis breakthrough
👉 点击此处阅读采访全文:  TESCAN凭借人工智能故障分析的突破，在先进封装领域确立了自己的地位

Highlights from the interview: 

  • Why APAC, why now—and why being “a beat late” might still be perfect timing 

  • How AI is cutting prep time from hours to minutes and solving the industry’s biggest bottleneck 

  • What sets TESCAN apart in a crowded market—and why local teams are key to global growth