Driving Innovation: Hervé Mace on TESCAN's Significant Semiconductor Vision

With the semiconductor industry poised for explosive growth, TESCAN is stepping up its game in electron microscopy through the launch of its innovative systems: Solaris 2, Solaris X 2. In an exclusive interview, Hervé Mace, new Global Director of Business Development at TESCAN, shares insights into the company’s agile approach to innovation and the vital role its advanced technologies will play in enhancing failure analysis and quality control in this rapidly evolving market.

Could you tell us about your background and how you got started in the semiconductor industry?

I began my journey in the semiconductor industry back in 1992, after completing a PhD in electronics at Grenoble (ENSICAEN). Early in my career, I worked as a process engineer and process manager, handling various roles in companies like Philips, General Electric, and later in specialized semiconductor firms. Over time, I transitioned into sales and business development, which has given me a unique perspective on both the technical and commercial aspects of the industry. It’s been fascinating to witness how the industry has evolved, and I’ve always been drawn to roles that allow me to drive growth and innovation.

 

What made you decide to join TESCAN, and what do you find appealing about the company?

Joining TESCAN felt like the right step for several reasons. For one, it’s the only major player that focuses exclusively on electron microscopy. I was also impressed by the changes within TESCAN’s management structure, as well as the strategic shift to strengthen our presence in the semiconductor market. I could see that TESCAN’s size allows for a lot of agility. Here, we can make decisions quickly—sometimes within days—which is quite rare in this field. I also appreciate the collaborative approach between our leadership team and our investment partners, which allows us to adapt and act swiftly when needed.

 

TESCAN has recently launched Solaris 2, Solaris X 2, and AMBER X 2. What inspired the development of these systems, and how do they align with TESCAN's commitment to innovation?

Innovation is vital in the semiconductor industry, where technological advancements happen at breakneck speed. At TESCAN, we track product vitality, which measures how much of our revenue comes from products introduced within the last two years. A high product vitality score reflects a company's dedication to keeping up with industry changes, and we’re proud that TESCAN has been able to significantly accelerate its development pace. The Solaris X 2 and AMBER X 2, for example, are designed to meet the specific needs of semiconductor Labs, with unique capabilities like AI-driven, advanced TEM lamella preparation, and in-situ electrical analysis. These features enable engineers to conduct failure analysis, technology development and quality control with unprecedented accuracy and efficiency, aligning with our goal of staying at the forefront of semiconductor innovation.

 

How do these features enhance semiconductor research and failure analysis?

In the semiconductor industry, we’re not just providing equipment; we’re offering complete solutions and workflows that integrate seamlessly into our customers' processes. For example, we’ve developed a large-volume ablation workflow that combines X-ray micro-CT for non-destructive analysis, femtoseconds laser combined with plasma FIB for both fast localization and detailed failure analysis. This combination allows our customers to move from a high-level, non-invasive scan to targeted, detailed investigations, optimizing both speed and accuracy. Given the high sample throughput requirements in this industry, our customers need workflows that are not only efficient but scalable. With TESCAN, we offer connected systems that can handle the complexity and volume of today’s semiconductor research demands.

 

What are the main challenges you see in the semiconductor industry, and how is TESCAN positioned to address them?

The semiconductor market is projected to grow dramatically in the coming years, potentially reaching $1 trillion by 2030. Much of this growth will be fueled by advances in high-memory computing, generative AI, and new materials. To keep pace, we’re focusing on developing hybrid systems that combine various techniques, like plasma FIB with laser technology, or broad-beam argon with SEM capabilities. By integrating these technologies, we’re moving beyond offering standalone systems to becoming a provider of comprehensive solutions that include data analysis and workflow integration. This approach will be essential as the industry moves toward a more data-centric model where the focus is not just on capturing images, but on extracting meaningful, actionable information that can drive decision-making.

 

Could you outline TESCAN’s key goals in the semiconductor market over the next few years?

TESCAN’s primary objective is to become deeply embedded in the semiconductor industry’s value chain. We see multiple entry points across various segments, from failure analysis and process monitoring to metrology and surface characterization. We’re also aiming to increase our involvement in high-volume manufacturing, where we can make a substantial impact by providing high-resolution analytical techniques that ensure device quality and reliability. This applies across a range of areas, including displays, packaging, memory, and wide-bandgap materials. By expanding our reach, we want TESCAN to become a central player in the semiconductor ecosystem, contributing to every stage of the development and manufacturing processes.

 

How does TESCAN’s approach to innovation set it apart in the field of FIB-SEM and related technologies?

FIB-SEM is an incredibly versatile technology, encompassing everything from sample navigation and imaging to advanced sample preparation and electrical probing. We’re enhancing these capabilities with AI and machine learning to further expand their applications. For instance, plasma FIB will increasingly be used in combination with other techniques, like laser ablation, to allow for even more precise and versatile analysis. At TESCAN, we’re moving from being a provider of imaging systems to a true solution provider, helping customers make informed pass/fail decisions quickly and accurately. This shift involves a focus on data output rather than just imaging, where we can deliver insights like grain orientation, chemical composition, and material strain—critical data that supports our customers’ decision-making processes.

 

Which regional markets offer the most growth potential for TESCAN’s electron microscopy solutions?

Traditionally, around 70% of the semiconductor market has been concentrated in the Asia-Pacific region, with the rest split between the U.S. (20%) and Europe (10%). However, the pandemic has highlighted the vulnerabilities of a globalized supply chain, and countries like the U.S. and members of the EU are now making substantial investments in their own semiconductor sectors. The U.S. and European CHIP Acts, for instance, are steps towards rebalancing the global supply chain, and we’re seeing a shift in focus towards these regions. While Asia will remain a key market for us, we anticipate significant growth in the U.S. and Europe as they work to expand their domestic capabilities.

 

How does TESCAN plan to build relationships with key stakeholders in the semiconductor ecosystem?

The semiconductor industry thrives on collaboration, not only with manufacturing leaders but also with academia and research institutes. Our approach is to cultivate “deep and wide” relationships that span the entire ecosystem. This means engaging with academic institutions to understand the fundamental physics, partnering with research institutes for pathfinding, and collaborating with manufacturing leaders to ensure our solutions are scalable. By working closely with key opinion leaders and institutions, TESCAN can stay ahead of market trends and help shape the future of semiconductor technology.

 

Is there anything else you’d like to add about TESCAN’s evolving role in the semiconductor industry?

I believe we’re at a transformative point for TESCAN. Historically, we were seen as a small, regional player, but recent developments have shifted that perception. Our presence at major conferences, coupled with our new leadership and strategic direction, has shown the industry that TESCAN is a serious competitor. My goal is to help TESCAN grow from a company with a modest market share into a major player within the electron microscopy field, ultimately contributing to the semiconductor industry's advancement in a significant way.

About TESCAN GROUP  

TESCAN was established in 1991 and has grown from a 4-5 engineer start-up initially, to a company with more than 700 employees working from more than 10 facilities in 8 countries.

We are a leading player in charged-particle optical instrumentation, including Scanning and Scanning Transmission Electron Microscopy (SEM & STEM), Focused Ion Beam (FIB) and X-ray Computed Tomography (micro-CT), with more than 4000 instruments sold and operational in more than 80 countries.  

  

In 2013, it expanded by merging with ORSAY PHYSICS, a French global leader in customized focused ion and electron beam technologies, and in 2018 by acquiring XRE, a Belgian innovator in the field of Dynamic and micro-CT technologies.

A further, more recent milestone was the acquisition in 2023 of TESCAN ORSAY HOLDING and all its subsidiaries by CARLYLE, a US private equity company.

TESCAN GROUP is headquartered in Brno, Czech Republic, where most of our instruments are expertly assembled, tested, and shipped to customers across the globe. 

Press Contact 

For further information, interview requests, or media inquiries, please contact:  

Linda Bilal, Senior Global Marketing Manager

Marketing Department      
TESCAN GROUP, a.s.

Libušina tř. 21; 623 00 Brno – Kohoutovice      
Czech Republic 

Phone: +420 530 353 478      
Email: linda.bilal@tescan.com