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Physical Failure Analysis of a MEMS Motion Sensor

Creating 1 mm-wide cross sections with TESCAN SOLARIS X

Microelectromechanical systems (MEMS) are commonly used as actuators, sensors, radio frequency and microfluidic components throughout a variety of applications in health care, automotive and military industries. However, there are considerable challenges with both fabrication and packaging of such devices.

In particular, issues related to yield and reliability need to be overcome.