M&M 2024

We look forward to meeting you at M&M 2024 in Cleveland, Ohio, USA from July 29th to August 1st, 2024.

Meet us now...
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The TESCAN Global Team is excited to meet you at BOOTH 521 during M&M 2024 in Cleveland, Ohio. Our full list of scientific talks, vendor tutorials, and demo opportunities are listed below. Please make sure to register in advance for our in-booth activities, space is limited!

 

Opportunities to learn and experience TESCAN during M&M 2024 include: 

 

  • New, AI-assisted TEM lamella prep automation including automated lift-out;

  • New, low kV lamella polishing capabilities;

  • TESCAN TENSOR 4D-STEM. This cutting-edge technology is specifically designed to cater to the needs of researchers and professionals engaged in multimodal nano-characterization applications;

 

  • TESCAN SPECTRAL CT.  For the first time in a commercial micro-CT system, we can acquire chemical data, such as identification of precious metals for mining and recycling, differentiate between different polymers in engineered samples, or optimize contrast in biological samples; 

  • microCT tomography of the whole battery cell-up-1200pxLearn about our  Battery Research Analytical Workflow, where our optimized TESCAN FIB-SEM solution for lithium-ion battery characterization. Discover how our unique combination of high-current FIB, field-free UHR SEM, and integrated ToF-SIMS can revolutionize your battery research, enabling you to make significant advancements in the field;

 

 

  • Engage in a discussion with our Life Sciences experts, who will be available to explore the realms of 2D and 3D characterization of biological samples. Learn about groundbreaking techniques such as plasma FIB for overcoming Cryo-ET sample preparation bottlenecks, and ultra-fast cryo on-grid lamella preparation and lift-out from challenging samples. 

  

Don't miss out on this unparalleled opportunity to witness the forefront of microscopy technology and stay at the cutting edge of scientific advancements. 

Register for a Demo

TESCAN-AMBER-1

NEW! TESCAN AMBER

Versatile nanoanalytical FIB-SEM to expand your materials research capabilities

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Register for a Demo
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TESCAN AMBER

For demo bookings please contact our booth reception. We will try to accommodate your needs.

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TESCAN-CLARA-MS-revised

TESCAN CLARA

UHR SEM for fast, accurate, and comprehensive nanoscale surface analysis of any material

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Register for a Demo
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TESCAN CLARA

For demo bookings please contact our booth reception. We will try to accommodate your needs.

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TENSOR with cabinets-1

TESCAN TENSOR

The first near-UHV 4D-STEM that is Integrated, Precession-Assisted, and Analytical

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TESCAN TENSOR

For demo bookings please contact our booth reception. We will try to accommodate your needs.

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UniTOMHR

TESCAN Micro-CT

Get the full picture, layer by layer. Your nondestructive, immediate truth via intuitive tools for 3D and 4D data processing.

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Micro-CT

For demo bookings please contact our booth reception. We will try to accommodate your needs.

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Scientific Presentations

Monday July 29
03:00 PM - 05:00 PM
Spectral CT

Spectral micro-CT imaging of minerals: retrieving atomic information and density maps

Wesley De Boever
by Wesley De Boever, Ph.D.
Exhibit Hall Poster Board 17
2 hrs
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Micro CT

Registration form

Monday July 29
03:00 PM - 05:00 PM
STEM Poster session image-2

A New Fully Integrated Retractable 4D STEM Detector for Scanning Electron Microscopes Using Timepix3 Based Pixelated Detector

Rastislav Motuz
by Rastislav Motuz, Ph.D.
Exhibit Hall Poster Board 52
2 hrs
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Micro CT

Registration form

Tuesday July 30
11:45 AM - 12:00 PM
CT Battery presentation

Battery electrolyte behavior during formation and heating: new insights using high-resolution and dynamic micro-CT

Ksenjia
by Ksenija Nikolic, Ph.D.
Huntington Convention Center Room 19
15 mins
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Micro CT

Registration form

Thursday August 1
10:00 AM - 12:00 PM
STEM Strain-1

Precession-Assisted 4D-STEM Strain Characterization of Semiconductor Devices

Nithin
by Nithin Balaji Venkataraman Iyappan Shankar
Exhibit Hall
2 hrs
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Micro CT

Registration form

Vendor Tutorials

Monday July 29
05:45 PM - 06:30 PM

AI-Assisted TEM Lamella Prep Automation with Automated Lift-out 

Martin Slama photo
by Martin Slama
TESCAN Booth 521
45 mins
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Micro CT

Registration form

Tuesday July 30
05:45 PM - 06:30 PM

Advanced Low kV Lamella Polishing Capabilities down to 100 eV 

Martin Slama photo
by Martin Slama
TESCAN Booth 521
45 mins
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Micro CT

Registration form

Wednesday July 31
05:45 PM - 06:30 PM

Boosting performance and productivity of multimodal analytical STEM by using 100 kV

Daniel Nemecek-1
by Daniel Nemecek, Ph.D.
TESCAN Booth 521
45 mins
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AMBER X 2

Registration form

Find Us Here

 

 

Untitled (4)

 

Microscopy & Microanalysis

BOOTH 521

 

Huntington Convention Center

300 Lakeside Avenue

Cleveland, OH 44113

United States

Not attending?

 

If you are unable to attend this conference, we will be happy to contact you, if you have any questions or requests.