IMC 2023 Busan
You are cordially invited to join us at
20th International Microscopy Congress 2023,
taking place in Busan, Korea
from September 10th to September 15th, 2023.
The TESCAN Global Team is excited to announce our participation at the conference and we can't wait to meet you in person. We have curated an exciting lineup of events, including our staff's personal participation, engaging scientific presentations, and a range of captivating demo opportunities that you won't want to miss.
Join us at TESCAN's booth #S09 and experience the following highlights during the conference:
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Be among the first to witness a live demo of our groundbreaking TENSOR 4D-STEM. This cutting-edge technology is specifically designed to cater to the needs of researchers and professionals engaged in multimodal nano-characterization applications. Explore its capabilities in morphological, chemical, and structural analysis, making it an invaluable tool for materials scientists, semiconductor R&D and failure analysis engineers, and crystallographers;
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Prepare to be amazed by the TESCAN UniTOM HR, a versatile micro-CT system that combines high spatial resolution with impressive temporal resolution. Whether you're interested in static or dynamic imaging, this state-of-the-art equipment fulfills all your imaging requirements, providing remarkable insights into the world of microscopy;
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Dive into the realm of Battery Research Analytical Workflow, where we present our optimized TESCAN FIB-SEM solution for lithium-ion battery characterization. Discover how our unique combination of high-current FIB, field-free UHR SEM, and integrated ToF-SIMS can revolutionize your battery research, enabling you to make significant advancements in the field;
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Experience the Power of Plasma FIB-SEM and the Innovative TESCAN Large Volume Workflow Master IC Packaging Failure Analysis with TESCAN Solutions;
- Engage in stimulating discussions with our Life Sciences experts, who will be available to explore the realms of 2D and 3D characterization of biological samples. Learn about groundbreaking techniques such as plasma FIB for overcoming Cryo-ET sample preparation bottlenecks, and ultra-fast cryo on-grid lamella preparation and lift-out from challenging samples. Gain insights into the latest innovations in the field and unlock new possibilities in your research.
Don't miss out on this unparalleled opportunity to witness the forefront of microscopy technology and stay at the cutting edge of scientific advancements.
We eagerly anticipate your presence at the conference and look forward to connecting with you soon.
Book a live demo at the IMC 2023!
TESCAN TENSOR
Experience an exclusive TENSOR demo. The first near-UHV 4D-STEM.
TESCAN TENSOR
Registration form
TESCAN AMBER X
A unique combination of Plasma FIB and field-free UHR FE-SEM for multiscale materials characterization.
TESCAN AMBER X
Registration form
Commercial Workshop
Empowering Innovation in Science with TESCAN Solutions
Exhibition Hall 1, Room No. 315, BEXCO
9:00-11:00
Advancing multimodal characterization of nanoscale morphological, chemical, and structural properties of functional materials, thin films, and synthetic particles, with stand-out 4D-STEM performance and unprecedented usability
Presenter: Daniel Němeček
11:00-11:15
Coffee break
11:15-13:00
Comprehensive multiscale characterization of electrochemical materials in battery designs using TESCANs Electron Microscopy and micro-CT Solutions
Presenters: Dirk van der Wal and Marijn Boone
13:00-13:30
Lunch
13:30-15:30
Boosting Physical Failure Analysis of Advanced Packaging, Logic and 3D NAND memory devices with TESCAN's Correlative Laser Ablation and Xe Plasma FIB-SEM Workflow
Presenter: Lukáš Hladík
Preparing Ultra-Thin TEM Samples from Sub-10 nm Semiconductor Technology Nodes in a Single Manipulation Step using TESCAN’s On Grid Advanced Lamella Geometry Solution
Presenter: Lukáš Hladík
15:30-15:45
Coffee break
15:45-18:00
Pushing Boundaries in Structural Analysis: Leveraging the Potential of TESCAN Solutions in Life Sciences
Presenters: Ondřej Šulák, Wei Ji, prof., Dominik Pinkas
Workshop
Registration form
Where to meet
BEXCO Exhibition Center 2
#55 APEC-ro
Haeundae-gu, Busan
Korea