Sample Preparation Perfected: Reproducible Ultra-Thin TEM Lamellae with AMBER 2 and fully FIB-SEM integrated Aura™ Gentle Ion Beam

About this webinar:

Achieving electron-transparent TEM specimens below 20 nm without compromising structure is a core challenge in high-resolution S/TEM materials characterization. In this webinar, we will demonstrate how TESCAN AMBER 2 with integrated  Aura™ Gentle Ion Beam developed in collaboration with Technoorg Linda, delivers dependable workflow for artefact-free high-quality ultra-thin TEM lamellae preparation. 

Attendees will explore: 

• A fully automated FIB-SEM workflow that ensures overnight preparation of TEM specimen 

• Practical benefits of low-kV argon ion polishing delivered by Aura™ Gentle Ion Beam 

• Real-world case studies highlighting reproducibility and minimized artefacts assured by Aura™ Gentle Ion Beam 

Join experts from TESCAN and Technoorg Linda to see how combining advanced AI-driven TEM lamella automation with cutting-edge Ar low keV ion polishing redefines standards in ultra-thin TEM sample preparation. 

Date & Time: 20.05.2025
Duration: ~ 60 minutes 

Speakers: 

• András Szigethy, CEO, Technoorg Linda

• Petr Klímek, Ph.D. Product Marketing Director, TESCAN 

• Márton Iritz, Application Specialist, Technoorg Linda

Key Learning Objectives: 

• Achieve sub-20 nm TEM lamellae with minimized amorphization and ion specimen damage 

• Understand the benefits and use cases of argon-based low-kV ion polishing 

• Discover how TESCAN AI-driven TEM lamella prep automation improves repeatability and TEM specimen preparation throughput 

Who Should Attend: TEM specialists, FIB-SEM users, materials scientists, electron microscopy professionals, and TEM specimen preparation specialists.. 

Register for the webinar here