TESCAN UHR FIB-SEM Solutions 

Characterization at the Surface and Below 

Unlock your research potential and visualize samples accurately, regardless of their characteristics or location. 

Insights

The Importance of visualizing complex details in your sample and using them in their full context

In materials science, it's vital to consider both narrow and broader context to avoid incorrect assumptions. Suppose the cross section prepared by FIB is too small or taken from a defect-free area? Will our conclusion be that the material we produce is of flawless quality? And what if 3D tomography is performed on a small volume and at shallow depth, revealing small grains overall?


Read our paper and learn more about why contextual data is essential for accurate materials investigation.

A scientific paper by TESCAN about the importance of visualizing complex details in TEM microscopy.

UHR Field Free FIB-SEM Imaging

All details from all samples

With field-free UHR technology, you can quickly and easily visualize and analyze topography, contrast, and more, regardless of your sample's characteristics. Whether your specimen is metallic, magnetic, non-conductive, charging, or beam-sensitive: Our ultra-high-resolution imaging performance delivers the low keV and high surface sensitivity needed for accurate analysis.

Visualize the truth. Consistently and with maximum contrast 

Contrast is key to a true understanding of surface topography and material composition. TESCAN-designed Backscattered Electron (BSE) detectors are made for today’s materials, with attention to not only conventional samples, but also beam-sensitive, emissive, or heated samples.

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Widest selection of BSE contrast methods

As the diversity in analyzed specimens grows, different BSE methods are required to properly describe phases of the investigated specimens. For this reason, it is crucial to select the appropriate BSE detector for the kind of information you need to collect from your sample.

DOWNLOAD the TESCAN Detectors Brochure
Two industrial drills acquired using the Wide Field Mode™ feature of the TESCAN SEM.

Macro. Micro. Nano. 

Start at 2x for navigation, then zoom to your feature of interest, collecting images at any point. Wide Field optics, UHR SEM and FIB work together to deliver multi-scale data, at and below the surface.

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TESCAN Wide Field™ mode

TESCAN Wide Field Optics™ mode is standard on all TESCAN SEMs and provides the most intuitive navigation experience by displaying the industry’s widest undistorted field of view in the live SEM window.

Download Wide Field Flyer

3D multimodal Characterization

It’s definitely about speed

TESCAN’s market-leading maximum beam current for FIB and piezo-driven aperture control enables preparation of the highest quality cross sections and 3D datasets in minimum time.

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TESCAN True X-Sectioning

TESCAN’s TRUE X-Sectioning utilizes a masking principle to provide a time-saving method for managing FIB beam tails and suppressing terrace artifacts — without sacrificing the high beam current advantage. 

DOWNLOAD the TRUE X-Sectioning Flyer

Challenging materials?
No problem.

Hard and soft material mixes, excessive topography or preferential sample orientation can create poor FIB-cut surface quality. TESCAN’s Rocking Stage and True X-Sectioning enable fast cross-sectioning and 3D analysis without compromising throughput or surface quality.

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TESCAN Rocking Stage

TESCAN Rocking Stage is fully compatible with TESCAN hardware and software to create an integrated solution for more efficient workflow execution and improved milling speed, accuracy and quality.

Download TESCAN Integrated Broad Ion Beam Flyer

3D Nanotomography. Effortless, but mighty. 

Specify the volume of interest. Define your acquisition parameters or follow our step-by-step guided workflows, then begin data collection. TESCAN’s Essence Tomography module makes it fast and straightforward for any operator to successfully perform 3D sample analysis.

And TESCAN’s own powerful 3D rendering engine delivers high-quality visualizations with several viewing options and exports comprehensive rendered animations. 

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TESCAN Essence™ Tomography module

TESCAN’s tomography module supports a wide range of imaging and analytical detectors, and is embedded in AMBER X’s Essence™ graphical user interface.

DOWNLOAD the Essence Tomography Flyer

3D EDS/EBSD.
Always dependable.
Always fast. 

Understand relationships between structure, composition, and crystallography — even in 3D. Large volume 3D EDS/EBSD is reliable and fast with TESCAN’s patented static setup for FIB-SEM slicing and 3D tomographic data acquisition.

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TESCAN 3D Volume Analysis software

TESCAN’s 3D Volume Analysis module is easy to learn, so both new and experienced users can produce complex 3D visualizations quickly. A step-by-step wizard guides the operator through the import, alignment, and pre-processing steps in their correct sequence, resulting in complete, detailed output for 3D visualization.

DOWNLOAD the 3D Volume Analysis flyer
DOWNLOAD Trial version of TESCAN 3D Volume Analysis Software

Embrace the lightest elements with Integrated ToF-SIMS

Analyze light elements and characterize the chemistry of samples containing Li, C, H, O or LiP with <50 nm spatial resolution at ppm concentration level. This is made possible using integrated TESCAN ToF-SIMS for 2D and 3D chemical analysis and visualization.

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TESCAN ToF-SIMS

TESCAN’s solution for secondary ion mass spectrometry (SIMS) integrates an orthogonal Time-of-Flight SIMS (ToF-SIMS) analyzer on a standard FIB-SEM system. The ToF-SIMS technique uses FIB to generate ionized particles, enabling high-spatial and high-depth resolution 3D chemical characterization of solid materials.

DOWNLOAD ToF SIMS Flyer

Room to do more

TESCAN’s large FIB-SEM chamber includes 20+ empty ports to accommodate TESCAN’s own purpose-designed detectors. These detectors are used for characterization of materials at elevated temperatures, or imaging beam sensitive and nonconductive specimens — with the space for more.

Have no fear. Move those samples. 

Essence™ Collision model is always on guard, preventing any hardware collision inside the closed FIB-SEM chamber during stage movement, sample tilting and detector insertion.

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TESCAN Essence™ 3D Collision Model

The Essence™ 3D Collision Model replicates the chamber interior and stage and detector motion. In doing so, it creates a virtual model that prevents collisions and helps users to adjust hardware positions for collision-free movements.

Download Essence 3D Collision Model Flyer

Proven Solution

Ultra High-Resolution FIB-SEM with Field Free technology

Proven solution to accommodate the widest range of applications and samples for the most demanding laboratories

jorge

"Xenon-based FIB technology dramatically increases the productivity of cutting the material dramatically so we can do our materials analysis in very short time"

Prof. Dr. Joerg Franke, Head of Department of Mechanical Engineering, FAPS

martin

"The FIB-SEM we have enables us to improve the world by pushing the boundaries of electronics, electromobility research and promoting sustainability through green energy research"

Martin Muckelbauer, Researcher in Department of Mechanical Engineering, FAPS

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Models and Features List

Fit the instrument to the main task

Volume analysis, the highest throughput and nanoscale characterization

A unique combination of plasma FIB and field-free UHR SEM for multiscale materials characterization and large area 3D tomography

A full view of TESCAN Plasma FIB-SEM (Amber X).
  • Increase analytical throughput and get valuable data faster by taking advantage of our market leading — 3 μA — beam current of the plasma iFIB™ and maximum field of view up to 1 mm
  • Speed cross-sectioning and 3D FIB-SEM tomography with improved surface quality using TESCAN Rocking Stage and our TRUE-X-Sectioning method
  • Enhance nanoanalytical sample characterization with high sensitivity ToF-SIMS analysis of light elements and trace materials’ concentrations
  • Boost your analytical potential by combining fully integrated, complementary techniques like EDS, EBSD, WDS, ToF-SIMS and Raman spectroscopy in one system
  • Collect reliable 3D analytical (EDS/EBSD) results faster using TESCAN’s patented static acquisition setup
DOWNLOAD TESCAN AMBER X Flyer

Nanoscale characterization, sample preparation and nanofabrication

Field-free UHR SEM and the most precise Ga FIB for sample preparation, nanoscale
characterization and 3D analysis

A full view of TESCAN Gallium FIB-SEM (Amber).
  • Achieve the highest precision for routine and advanced FIB sample preparation with AMBER‘s excellent FIB resolution and class-leading current density
  • Increase analytical throughput and get valuable data faster by taking advantage of our market leading — up to 100 nA — ion beam current
  • Enhance nanoanalytical sample characterization with high sensitivity ToF-SIMS analysis of light elements and trace materials’ concentrations
  • Boost your analytical potential by combining fully integrated, complementary techniques like EDS, EBSD, WDS, ToF-SIMS and Raman spectroscopy in one system
  • Collect reliable 3D analytical (EDS/EBSD) results faster using TESCAN’s patented static acquisition setup
DOWNLOAD TESCAN AMBER Flyer

Questions?
Need more information?

Our global team is available to answer questions about TESCAN FIB-SEMs and other solutions from TESCAN.