Plasma FIB-SEM & IC Packaging Failure Analysis | TESCAN Insights

Webinar Announcement: New insights from Semiconductor Failure Analysis with TESCAN's Integrated Workflow

Written by Tescan Semiconductors Team | Jan 16, 2024 9:46:20 AM

A Comprehensive Approach to Semiconductor FA 

Do you wish to stay abreast of the ever-evolving landscape of semiconductor technology and its impact on device efficiency and reliability? Join us on January 23rd, 2024, for a captivating webinar that will expand your perspective on semiconductor failure analysis.  

Guided by Lukas Hladik, Product Marketing Manager at TESCAN Group, this online session promises to bring new insights for professionals in the semiconductor industry. 

 

Webinar Title: “Streamlining Millimeter-Scale Semiconductor Failure Analysis: An Integrated Workflow with Plasma FIB-SEM, Laser Techniques, and Advanced FA Tools”

Date and Time: January 23rd, 2024, from 9 A.M. and 5 P.M.