Plasma FIB-SEM & IC Packaging Failure Analysis | TESCAN Insights

Tescan at ISTFA 2025: Advancing Failure Analysis

Written by Tescan Semiconductors Team | Sep 30, 2025 12:49:33 PM

We’re excited to be at ISTFA 2025, where Tescan is showcasing our advanced failure analysis workflows that empower engineers and scientists to:

⚡ Detect and localize defects quickly

⚡ Visualize hidden structures with 3D tomography

⚡ Gain complete insights through correlative analysis