Plasma FIB-SEM & IC Packaging Failure Analysis | TESCAN Insights

TESCAN at IPFA 2025 - Streamlined Failure Analysis for Advanced Packaging

Written by Tescan Semiconductors Team | Jun 19, 2025 12:59:19 PM

TESCAN is proud to join the 32nd International Symposium on the Physical Failure Analysis of Integrated Circuits (IPFA 2025) as a Gold Sponsor.