Plasma FIB-SEM & IC Packaging Failure Analysis | TESCAN Insights

“Plenty of room to grow.” – Sean Lee on Why TESCAN Is Doubling Down on APAC

Written by Tescan Semiconductors Team | May 22, 2025 9:20:49 AM

In his interview with DIGITIMES Asia, our APAC Managing Director shares how we’re scaling AI-driven failure analysis – and why Taiwan and Singapore is next.