TESCAN is part of an ongoing project, set to conclude in September 2023, called Failure Analysis (FA) 4.0. This project is focused on addressing the reliability and safety challenges within the fast-paced electronic systems industry. As a significant participant, TESCAN has co-developed AI/ML-driven tools and methodologies for detecting and mitigating defects in electronic components and systems. This approach aims to refine the processes of design, manufacturing, and maintenance for high-tech products, enhancing Europe's role in smart mobility and industrial production.