TESCAN Group is a regular participant at SEMICON Korea, and 2024 will be no exception. From January 31 to February 2, our team will be at booth C262, ready to demonstrate our advancements in deep sectioning and large-volume workflow techniques for IC Packaging Failure Analysis.
Since its inception in 1987 with a modest 189 booths, SEMICON Korea has evolved to become an essential event representing the current state of the semiconductor community. This year, the event scales new heights with over 500 exhibitors and 2100 booths, showcasing the latest in semiconductor technology and equipment.
Experience the present and future of the global semiconductor industry – more info here: https://expo.semi.org/korea2024