Leverage 3D ToF-SIMS Tomography for Battery Characterization
Unveil the intricate relationship between the local morphology and chemical state of battery components using fully automated 3D FIB-SEM tomography and integrated ToF-SIMS analysis. Unlike conventional ToF-SIMS depth profiling, 3D ToF-SIMS tomography provides precise volumetric chemical data, overcoming limitations imposed by the compositional and topographical heterogeneity of battery materials.
Advance your battery characterization and delve into the distribution of particles, binder, porosity, lithium, and other elements within the electrode.
Elevate Battery Characterization and Master Subsurface Analysis with Large-Scale Cross Sectioning
Enhance your statistical evaluation of battery materials through comprehensive subsurface analysis and characterization, even at the millimeter-scale. Utilize TESCAN's cutting-edge Xe plasma FIB technology, True X-Sectioning and Rocking Stage, to expedite cross section preparation and enhance quality by minimizing the uneven curtaining effect often observed in cross-sectioned battery electrodes.
Craft Custom Analytical Workflows for Battery Materials with an All-in-One Microscopy System
Gain comprehensive insights into battery processes and composition by correlating various analytical techniques within a single microscopy instrument. Create custom analytical workflows for surface and subsurface 2D/3D characterization of battery materials by combining ultra-high-resolution SEM observation, and phase, elemental and chemical state analysis with integrated EBSD, EDS, ToF-SIMS, and Raman spectroscopy. What's more, you can access specific subsurface regions of interest on your battery samples using FIB technology.
Safeguard Your Battery Samples for FIB Processing and Characterization
To ensure the safety of your lithium-based battery samples, utilize an inert gas transfer system. This will prevent exposure to air and moisture during transfer between the glove box and microscope vacuum chamber. By applying cryogenic conditions, you can also reduce damage to ion beam-sensitive samples and minimize material redeposition during FIB milling processes.
